Vacuum electron beam solders technology and its play body to process medium application in empty empty missile
- Time:
- Click:182
- source:WINNERS CNC Machining
In 15 Mm, amlposition quantity should not exceed 0.
20 Mm. 6 corrective welder add up to an axis to debug, corrective welder adds up to an axis to make namely the coincide of central axle photograph of the central axle of electron beam and focusing lens. Otherwise, electron beam is mixed with respect to possible diverge deflection, before every approve product solder, answer commonly corrective. 7 welder art parameter reachs his to debug (1) solder craft parameter. The craft parameter of electron beam solder basically includes to quicken voltage (KV) , focusing electric current (MA) , electron beam flows (MA) , solder speed (Mm/s) spend with the vacuum of atelier etc. Their change, will right of electron beam solder solder the effect that the appearance of cross section geometry of deepness, in-house quality and welding line produces different rate. · quickens voltage (KV) : When other condition is changeless, quicken voltage taller, solder frit is jumped over greatly big, because quicken,this is when voltage is elevatory, the power of electron beam and power density also increase subsequently, penetrable ability increases. Carry out a proof, electron beam is penetrable metallic deepness is as tall as what quicken voltage second just become direct ratio, also become inverse ratio with metallic density at the same time. · electron beam flows (MA) : When other condition is certain, increase electron beam electric current, the frit deep He Rongkuan of welding line can greaten, because electron beam electric current increases,this is when, although the power of electron beam increases, but its focusing function becomes poor, the power density of electron beam increases relatively delay, deep He Rongkuan increases the frit that reason expression is welding line at the same time. · focusing electric current (MA) : The central issue that the size of focusing electric current decided electron beam is in the position that is gotten on by direction of solder workpiece ply. When the focus of electron beam is in workpiece surface upper part, call medicinal powder anxious solder; When the focus is in the surface on workpiece, call exterior focusing; The focus is in workpiece ply limits when the focusing in calling; The focus is in the surface below workpiece to reach the following when become next focusing. Carry out a proof, solder frit is deep with electron beam in focusing is the biggest. Usually, when 2mm of ≤ of weldment ply δ , use medicinal powder anxious solder; When 10mm of ≤ of δ of < of weldment ply 2mm, use exterior focusing to solder; When 20mm of ≤ of δ of < of weldment ply 10mm, the focusing in using solders; When 20mm of > of weldment ply δ , need to use next focusing to solder. · solders speed (Mm/s) : Usually, solder rate increases, solder wiring energy is reduced, frit is on the geometrical figure that is reflected in welding line cross section wide with frit deep will reduce. The vacuum of · atelier spends: Spend when the vacuum of atelier when reducing, not only can make the contaminative rate of welding line increases, still can make electron beam produces scattering, the power of electron beam and power density are reduced, penetrable ability drops, make the frit of welding line deep reduce, deep wide than reducing. (2) solder of craft parameter debug. The in-house quality of electron beam welding line, solder deepness and appearance of cross section geometry, depend on not only craft parameter, and still mix with the power volume of electron beam welder, performance data, electron gun by the relative position between solder workpiece, be concerned by the technical characteristic of solder workpiece. Accordingly, when the craft parameter that debugs specific certain workpiece, the action that should understand adequately and is familiar with each parameter, mutual influence between them and match a relation, union is asked by the structural characteristic of solder workpiece, technology, the element such as precision of appearance of material sort and function, geometry, dimension, important rate, pass those who relapse for many times to solder experiment, final sieve singles out a group of first-rate to solder craft standard parameter. Ought to notice: What debug solder parameter examines in the exterior of test specimen welding line only, intensity of X- smooth flaw detection, connect accords with a design to ask entirely, passed 3 first solder after test and verify, ability is used at batch to produce. 8 workpiece solder (1) bundle stream in be opposite. The purpose is stain of electron beam of test and verify be located in from beginning to end when shift be gettinged on by solder workpiece on juncture line, its deviation should not exceed 0.
2 ~ 0.
3 Mm. (2) tack welding. It is with circumferential juncture exemple, usually, when 500mm of diametical φ ≤ , fixed position at 8 o'clock; When 500mm of diametical φ > , fixed position at 16 o'clock; Length of each bits is: Remove arc 2.
5 ° , solder 2 ° , receive arc 2.
5 ° . Bundle drifting size can be mixed according to the ply of cylindrical shell assemble clearance to master neatly, it is commonly solder bundle of drifting 25% ~ 35% , use when gap is big medicinal powder anxious, clearance can use exterior focusing when small or very close to each other is unoccupied place. (3) soldering and sealing. Solder to assure quality, avoid to burn wear the generation that waits for blemish, must undertake soldering and sealing. The size that the electron beam when soldering and sealing sheds inspects the clearance of juncture and decide, it is with can sealing juncture accurate, it is commonly solder bundle flow 30% the left and right sides, whether to use according to the size decision of clearance medicinal powder anxious. (4) solder. The size that the electron beam when soldering sheds does not appear with welding line front cave, the reverse side makes sure solder is appeared, the exterior shapes good undertake for the basis. (5) got-up solder. Shape when welding line surface undesirable or appear bite an edge, cave when waiting for blemish, can undertake got-up solder, when got-up solder bundle flow to be used commonly medicinal powder anxious, when its size and soldering and sealing basic and identical. Vacuum electron beam solders the technology plays body to process medium application in empty empty missile the 1 base that play a wing and of the cylindrical shell outside bombing put oneself in another's position solder the spare parts that the base that play a wing is fixed ala face, should bear the weight of in missile flight process the weight that plays completely, and when missile tracks a target to make motor-driven fly, bear even tens of times overload that measures at playing weight, it is empty empty missile in important bear force. It and rely on to solder to be an organic whole repeatedly between the cylindrical shell outside bombing put oneself in another's position, two spare partses all are made by steel of effectiveness for a given period of time of martensite of 0018Ni high strenth. When using solder of manual argon arc to solder, not only solder be out of shape big, circularity achieves a requirement not easily, and still can appear the base playing a wing that the graph shows 2 times and outside the interface of cylindrical shell relies on circumjacent solder to be together only, and the phenomenon that intermediate area still is separate two system structure. The better settlement after Nextpage uses method of electron beam solder this problem, not only dimension precision is taller, and came true to play tentative idea of complete connective of alar base and interface of the cylindrical shell outside bombing put oneself in another's position, machine with whole basic and identical, rose to play alar base to be opposite greatly the carrying capacity of empty empty missile. Of envelope of 2 helm face and framework solder the helm face of modern empty empty missile uses relatively advanced envelope framework structure commonly, material is taller than intensity TC4 titanium alloy. Resistor is used to roll solder join between envelope and envelope among them, between envelope and framework use resistor spot welding more before, to satisfy light quantified requirement, the comparison that framework width makes commonly is narrow, often happen when spot welding splatter, cause solder the dot is loose wait for blemish too greatly with impress, if use electron beam solder, can overcome this kind of phenomenon. Moreover, because electron beam solder is,solder below vacuum condition, those who avoided air to affect an area to welding line and heat erode and pollute, having favorable protective effect to titanium alloy, we are working in the test that develops this field now, if pursue,3 are shown. The 3 cylinder that bomb put oneself in another's position solder with what carry ring empty empty missile gets shot body cylinder and through circumferential welding line join is a whole between upright annulus. Assemble to facilitate, assure dimension precision, used the configuration of the butt joint end the lock. Using automatic tungsten extremely when argon arc solder solders, fused metal severely deflection plays body cylinder one party, if the graph is shown 4 times, ministry of the root end the lock that carrying ring appears not solder shows defect. Increase electric current to eliminate this kind of flaw, but burn the cylinder that bomb put oneself in another's position even when wearing, ministry of the root end the lock that carries ring still carries in good condition solid state form, did not fuse at all, not solder appears blemish to exist continuously. In the meantime, increase electric current overly to still can be in the hot influence of a side of the cylinder that bomb put oneself in another's position is caused inside the area cave, pass an analysis, we think this is end annulus and the thermal capacitance of the cylinder that bomb put oneself in another's position are lopsided, both differ too great disparity causes. Wall of the canister that carry ring is large, thermal capacitance is big, and wall of canister of the cylinder that bomb put oneself in another's position is thin, thermal capacitance is small, give at identical quantity of heat, the temperature of the cylinder that bomb put oneself in another's position rises quickly fused, and upright annulus warms up however slow, temperature is low, the place end the lock did not reach fused temperature and cause not solder shows defect. Use vacuum electron beam solder won't appear this kind of phenomenon, vacuum electron beam has energy density the characteristic with rapid input of tall, quantity of heat, deep and narrow penetrable welding line can be formed when soldering, reason juncture the thermal capacitance of two side is lopsided solder to its with the structure end the lock quality won't make an impact, won't arise not solder shows defect, this had gotten the test and verify of the experiment. Last word electron beam solders the technology is had with its other solder the characteristic that the method cannot replace and huge advantage was shown in the treatment that bombs put oneself in another's position in empty empty missile. The way that sides with long-range, high speed, tall motor-driven, tall overload as empty empty missile develops, a few exceed spare parts of material of light metal, high strenth, tall precision solder will be carried in succession program, all sorts of contact forms that implement hard also will appear in succession, this solders for electron beam technical application and development offerred capacious prospect. Believe to play system to build as empty empty missile to soldering of technical demand pull move and drawing, electron beam solders the technology will get develop further and be perfectinged, satisfy new generation conversely advanced empty empty missile is developing the requirement that to soldering the technology raises increasingly in the process. CNC Milling